Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Universal PCB Holder Preheating Platform Features :

Preheating Platform Features :

Voltage: 0

or with conventional components

Constant temperature Soldering iron based Intelligent automatic temperature controller

Product weight: 568g

Mbga-IP 26 IN 1 BGA Reballing Platform For iPhone 7 to 15 Pro Max Universal PCB Holder Preheating Platform Features :AMAOE Mbga IP WiFi Baseband CPU NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7 15 Pro Max. Mbga IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair. Option: Mbga IP 26 in 1 set ( 7 15PM) Mbga IP 14 14P kit Positioning plate Mbga IP 12 13 kit Positioning plate Mbga IP XS 11 kit Positioning plate Mbga IP 7 8 X Qualcomm kit Positioning plate Mbga IP 7 8 X Intel